LNP THERMOCOMP Lexan_EXCP0011
应用范围： 产品描述 LNP THERMOCOMP Lexan_EXCP0011SF008物性表 LNP* Thermocomp* Lexan_EXCP0011 compound is a 15% carbon fiber filled PC injection moulding resin. Material identification acc. ISO11469: >PC-CF15<
下载PDF
详细介绍
产品描述
LNP THERMOCOMP Lexan_EXCP0011SF008物性表
LNP* Thermocomp* Lexan_EXCP0011 compound is a 15% carbon fiber filled PC injection moulding resin. Material identification acc. ISO11469: >PC-CF15<
来源：http://www.va-so.com/product827911.html
发布时间：2022/5/9 11:39:49
上一个：LNP THERMOCOMP Lexan_EXCP0008
下一个：LEXAN PC FXM921A
